TLF01 MULTIFINGER SOLDERRING MACHINE



FEATURES

  1. The Tanac TLF-001 stand-alone machine has the sophistication of CNC controls, yet is simple to program and operate.

  2. Programming is done through the simple push button screen.

  3. A RS232C serial port is provided to upload and download programs.

SPECIFICATIONS

Bobbin Loading

Manual Loading Fixture

Bobbin Unloading Auto Eject to Shoot
Bobbin Outside Diameter 30mm(Max)
Number of Fingers 6(30mm pich) or 12(15mm pich)/ Select by a bobbin size
Fluxing Bucket Type
Soldering Method Bucket Type
Solder Providing Method Auto Providing
Available Soldering Area 180mm X 20mm
Solder Temperature MAX 450cK
Positioning of Y,Z & R axis Fully Programmable
Power Source Single 208VAC/50Hz/60Hz
Power Comsumption 2 Kw
Air Required 80psi(Min)/1cfm.
Dimensions 650(W)~950(D)~1200(H)mm
Weight 200 Kgs(1bs)
OPTIONS Standard type of pick and place fingers
Special type of pick and place fingers for small SMD coils
Dobble stacks type, Pallet size 140mm x 200m
Continuity testing and reject

TANAKA SEIKI CO., LTD.